Cong (Robin) Shen

About

I work on generative AI for chip thermal and power simulation, and on using it to drive more efficient thermal management. The aim is real-time temperature and power prediction, accurate enough to support hotspot-triggered dynamic power management on chip rather than thermal information that only arrives after an offline solve.

Before joining Minnesota I worked on algorithm-based device reliability and compact modeling at Peking University. I have 11 publications to date, 4 as first or co-first author, in journals and conferences including Nature and IEEE T-ED.

Publications

Journal

[J1]

Chi Liu^∗#, Xin-Zhe Wang^#, Cong Shen^#, Lai-Peng Ma^#, Xu-Qi Yang, Yue Kong, Wei Ma, Yan Liang, et al.

A hot-emitter transistor based on stimulated emission of heated carriers

Nature Nature 632(8026), 782–787, 2024 · Co-first author · Paper

[J2]

C. Shen, Y. Li, B. Peng, Z. Wang, Y. Xue, Y. Zhao, P. Ren, L. Zhang, R. Wang

Dynamic Modeling of Parametric Shifts in FinFETs Under Hot Carrier Degradations

IEEE T-ED IEEE Transactions on Electron Devices 73(1), 63–70, 2025 · Paper

[J3]

Y. Li, S. Chen, C. Shen, Z. Sun, R. Wang, L. Zhang

A Dynamic Time Evolution Method for Accelerating Self-Heating Simulations of Advanced Technologies

IEEE T-ED IEEE Transactions on Electron Devices, 2025 · Paper

[J4]

Y. Li, C. Shen, S. Chen, Z. Sun, Z. Wang, R. Wang, L. Zhang

Cross-Layer Modeling and Simulation for Electrothermal-Reliability With Backside Power Delivery Networks

IEEE JEDS IEEE Journal of the Electron Devices Society, 2025 · Paper

[J5]

C. Shen, Y. Li, Z. Wang, L. Zhang, R. Wang, R. Huang

A Neural Network Approach for Parameterizations of Hot Carrier Degradation Models

IEEE JEDS IEEE Journal of the Electron Devices Society 13, 756–761, 2024 · Paper

[J6]

Y. Li, Y. Xue, Z. Sun, C. Shen, P. Ren, Z. Ji, L. Zhang, R. Wang

A Device-Circuit Aging Simulation Framework Integrating Trap-Based Models and Sensitivity Analysis for FinFET Technology

IEEE T-ED IEEE Transactions on Electron Devices 71(1), 206–212, 2023 · Paper

[J7]

M. Liu, Z. Sun, H. Lu, C. Shen, L. Zhang, R. Wang, R. Huang

A Coupling Mechanism between Flicker Noise and Hot Carrier Degradations in FinFETs

Nanomaterials Nanomaterials 13(9), 1507, 2023 · Paper

Conference

[C1]

C. Shen, Y. Li, W. Dai, X. Zhang, Z. Wang, Z. Ji, L. Zhang, R. Wang, R. Huang

A neural network based fast parameter extraction of compact hot carrier degradation model in FinFETs

EDTM 2024 IEEE Electron Devices Technology & Manufacturing Conference, 1–3, oral · Paper

[C2]

X. Zhang, F. Zhang, C. Shen, Z. Wang, R. Wang, L. Zhang, R. Huang

Modeling the Temperature-Dependence of Silicon Diode with Fermi-Dirac Statistics down to 50K

ISEDA 2024 International Symposium of Electronics Design Automation, 37–41 · Paper

[C3]

Z. Wang, H. Lu, Z. Sun, C. Shen, B. Peng, W. F. Li, Y. Xue, D. Wang, Z. Ji, et al.

New insights into the interface trap generation during hot carrier degradation: Impacts of full-band electronic resonance, (100) vs (110), and nMOS vs pMOS

IEDM 2023 IEEE International Electron Devices Meeting, 1–4 · Paper

[C4]

F. Zhang, S. Cong, K. Wang, L. Zhang, Q. Huang

Investigation of the temperature dependence of Bulk-Si TFET and MFSB-TFET by TCAD simulation

ICSICT 2022 IEEE International Conference on Solid-State & Integrated Circuit Technology · Paper

^# Equal contribution · ^∗ Corresponding author

Patents

[P1]

Lining Zhang, Cong Shen, Yu Li, Runsheng Wang

Parameter extraction methods for aging models of semiconductor devices

Chinese Patent

[P2]

Lining Zhang, Cong Shen, Yu Li, Runsheng Wang

A modeling and simulation prediction method for aging effects in semiconductor devices

Chinese Patent

Education

PhD in Electrical & Computer Engineering

University of Minnesota, Twin Cities · Sep. 2025 – present

Advised by Prof. Yu (Kevin) Cao, MEC Group

M.Sc. in Integrated Circuit

Peking University, School of Electronic and Computer Engineering · Sep. 2022 – Jun. 2025

GPA 3.7/4.0, ranked 1/62 · Advised by Prof. Lining Zhang

Outstanding Graduate of Beijing (北京市优秀毕业生)
National Scholarship (国家奖学金)
Outstanding Merit Student (优秀学生)
Academic Innovation Award (学术创新奖)
First Place, “Baidu Cup” Innovation Star Academy Competition (“百度杯”创新之星学院赛第一名)

B.S. in Microelectronics

Lanzhou University, School of Physical Science and Technology · Sep. 2018 – Jun. 2022

GPA 3.7/4.0, ranked 3/87

Outstanding Graduate (优秀毕业生)
First Prize Scholarship, 2018–2021 (一等奖学金)

Skills

Programming Python, Verilog-A, MATLAB, C

Machine learning PyTorch, diffusion models, graph neural networks

Software Sentaurus TCAD, HSPICE, Cadence Virtuoso, Cadence Celsius, Origin

Languages Mandarin Chinese (native), English (professional working proficiency)

Cong (Robin) Shen 沈聪